Osram ORBEOS Components Bedienungsanleitung

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www.osram.com/oled
Application guide.
ORBEOS
®
APRIL
2011
Seitenansicht 0
1 2 3 4 5 6 ... 19 20

Inhaltsverzeichnis

Seite 1 - Application guide

www.osram.com/oledApplication guide.ORBEOS®APRIL2011

Seite 2 - CONTENTS

10BINNINGA widely-used standard for the classifi cation of chromaticity in SSL application is “ANSI_NEMA_ANSLG C78.377-2008” (http://www.nema.org/stds/

Seite 3

11BINNINGOSRAM has established a fi ner resolution classifi cation and has divided the ANSI-NEMA color boxes into smaller sub-bins (so called “fi ne-bins

Seite 4 - 1. OLED integration

12BINNING2.2. Luminance binningBrightness binning of OLEDs is slightly different than for LED products. While inorganic LEDs rely on luminous intensit

Seite 5 - OLED INTEGRATION

134.1. Maximum ratingsTable 3: OLED maximum ratings.3. DrivingIn general, OLEDs are driven in constant current mode. If dimming is required, it is rec

Seite 6 - 1.3. Interconnection

14RELIABILITY4.2. Degradation4.3. Lifetime1.000.750.500.2500 2,500 5,000 7,500 10,000 12,500 15,000 17,500Operating time [h]Relative luminance [L/L0]I

Seite 7

15RELIABILITY4.4. RobustnessIn the following paragraphs, some indications are given on the ruggedness of OLEDs and their stability against some enviro

Seite 8 - 1.6. Contacting via Flex-PCB

16APPENDIXAppendixCorner values (CIE coordinates) of all 4C9X fi ne-binsBin cx cy Bin cx cy Bin cx cy Bin cx cy8C 0.3028 0.3304 8J 0.3548 0.3736 9Q 0.4

Seite 9

17APPENDIXCorner values (CIE coordinates) of all 4C9X fi ne-binsBin cx cy Bin cx cy Bin cx cy Bin cx cy7E 0.3154 0.3352 7L 0.3714 0.3775 4R 0.4109 0.37

Seite 10 - 2. Binning

18APPENDIXCorner values (CIE coordinates) of all 4C9X fi ne-binsBin cx cy Bin cx cy Bin cx cy Bin cx cy6G 0.3293 0.3384 6N 0.3853 0.3776 5T 0.4298 0.38

Seite 11

19APPENDIXCorner values (CIE coordinates) of all 4C9X fi ne-binsBin cx cy Bin cx cy Bin cx cy Bin cx cy5I 0.344 0.3428 7P 0.4036 0.3898 6V 0.4477 0.399

Seite 13 - Relative humidity 40 °C/93 %

www.osram.com/oled04/11 OSRAM CRM MK AB OSRAM does not accept liability for errors, changes and omissions.Global presence.OSRAM supplies customers in

Seite 14 - 4.3. Lifetime

3CONTENTS1. OLED integration 41.1. General handling instructions 41.2. Contact ledges and their polarity 51.3. Interconnection 61.4. Contacting

Seite 15 - 4.4. Robustness

4OLED INTEGRATIONRemember when handling OLED devices: First and fore-most, OLEDs are made of glass and glass is fragile. • Avoid mechanical stress suc

Seite 16 - Appendix

5OLED INTEGRATIONOLED devices without Flex-PCB (for Flex-PCB, please see below) are electrically connected via the metallized areas at the contact led

Seite 17 - APPENDIX

6OLED INTEGRATIONOn the following pages, several techniques for interconnec-ting OLEDs are described. To interconnect OLED devices, their contact surf

Seite 18

7OLED INTEGRATIONIn this example, elastomeric connectors are used for inter-connecting OLEDs. Similar low-resistance connectors can be used accordingl

Seite 19

8OLED INTEGRATION1.6. Contacting via Flex-PCBThe application of Flex-PCBs (fl exible printed circuit boards) allows the connection of an OLED device wi

Seite 20 - OSRAM GmbH

9OLED INTEGRATIONFlex-PCBs are applied by a special conductive polymer mate-rial in a thermo-compression process called ACF bonding (anisotropic condu

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